Cut efficiency of Wafer Dicing saw(Si Wafer),8inches Silicone(Si) Wafer,Cut cell size : 160 ㎛ x 160 ㎛

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Last update : 2020-11-10 [2400 view]

SR******* Company Name

Country of origin: KOREA

Model number: Wafer Dicing saw

Brand: SR Semiconductor

Price:

Company location: KOREA Seoul Jungnang-gu